Transfer method of expanding pitches of device and an apparatus for performing the same

A transfer method for expanding pitches of devices includes: providing a first substrate with micro devices having the pitches being a predetermined value in a first direction and a second direction; transferring the micro devices to a first roller by contacting it with the micro devices, wherein a...

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Bibliographische Detailangaben
Hauptverfasser:	Lee, Kang-Feng, Pan, Yi-Tsung
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICESUSING STATIC MEANS TO PRESENT VARIABLE INFORMATION BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DECORATIVE ARTS DISPLAY EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES MOSAICS NANOTECHNOLOGY PAPERHANGING PERFORMING OPERATIONS PHYSICS PRINTING PRINTING MACHINES OR PRESSES PRODUCING DECORATIVE EFFECTS SEALS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES STAMPS TARSIA WORK TRANSPORTING TYPEWRITERS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A transfer method for expanding pitches of devices includes: providing a first substrate with micro devices having the pitches being a predetermined value in a first direction and a second direction; transferring the micro devices to a first roller by contacting it with the micro devices, wherein a pitch of contact line portions on the first roller is N times of the predetermined value; transferring the micro devices on the first roller to a second substrate; rotating the second substrate by 90 degrees; transferring the micro devices to a second roller by rolling the second roller to contact the micro devices; and then transferring the micro devices to a third substrate to expand the pitch of the micro devices in both the first and the second directions. The portions in contact with the micro devices all have adhesive layers with different adhesion operation windows.