Photocurable epoxy resin systems

The invention is directed to a photocurable epoxy resin composition that is tougher and more flexible and contains 30 to 90 wt % of at least one aromatic epoxy resin; 2 to 30 wt % of at least one core-shell rubber (CSR); up to 20 wt % of at least one flexibilizer comprising reactive functional group...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Hagenbucher, Melanie, Hornung, Martin
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The invention is directed to a photocurable epoxy resin composition that is tougher and more flexible and contains 30 to 90 wt % of at least one aromatic epoxy resin; 2 to 30 wt % of at least one core-shell rubber (CSR); up to 20 wt % of at least one flexibilizer comprising reactive functional groups selected from among epoxy groups, carboxylate groups, amino groups and/or hydroxyl groups; and 1 to 4 wt % of at least one cationic photoinitiator. Also disclosed are the use of said composition for sealing and/or coating materials as well as corresponding coating/sealing processes.