Soft wrap substrate

A molded component having a thickness reduction feature is provided. The molded component can include an injection molded polymer substrate having a front panel, a side panel, and a corner between and adjoining the front panel and the side panel. The substrate can also have a groove extending along...

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Bibliographische Detailangaben
Hauptverfasser:	Penner, Benjamin Warren, Zellner, Jr., Kerry Scott
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A molded component having a thickness reduction feature is provided. The molded component can include an injection molded polymer substrate having a front panel, a side panel, and a corner between and adjoining the front panel and the side panel. The substrate can also have a groove extending along the corner between the front panel and the side panel, the groove having a front panel edge and a side panel edge. The front panel edge and/or side panel edge have a dentil profile edge, the dentil profile edge reducing an effective thickness of the corner and thus providing increased or controlled cooling of the substrate.