Process and device for introducing additive materials in a receptacle at the area of highest pressure

A method and a device for introducing and/or adding non-dry-powder additive materials and/or coating materials with a liquid, solid, semi-solid, or paste-like consistency or in suspended or emulsified form, for example, peroxides, fats, waxes, IV improvers, polymers, or similar materials, to an exis...

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Bibliographische Detailangaben
Hauptverfasser:	Wendelin, Gerhard, Hackl, Manfred, Feichtinger, Klaus
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CRUSHING, PULVERISING, OR DISINTEGRATING CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL DIAGNOSIS ELECTROTHERAPY HUMAN NECESSITIES HYGIENE IDENTIFICATION INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MAGNETOTHERAPY MAKING GRANULES OR PREFORMS MEDICAL OR VETERINARY SCIENCE MILLING GRAIN MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED PREPARATORY TREATMENT OF GRAIN FOR MILLING RADIATION THERAPY RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SURGERY TRANSPORTING ULTRASOUND THERAPY WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A method and a device for introducing and/or adding non-dry-powder additive materials and/or coating materials with a liquid, solid, semi-solid, or paste-like consistency or in suspended or emulsified form, for example, peroxides, fats, waxes, IV improvers, polymers, or similar materials, to an existing lumpy or particulate material which is moved and mixed, and optionally warmed and reduced to small pieces in a receptacle and/or compressor, said material being in particular polymer particles and/or flakes, wood fibers, paper cuttings, or similar materials. According to the invention, the additive material is introduced below the level of the material and/or material particles already in the receptacle.