Vertical wire connections for integrated circuit package

Vertical wire connections for integrated circuit package

A method includes aligning a wire with a package body having a contact pad and moving the wire through the package body to form electrical contact with the contact pad.

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Bibliographische Detailangaben
Hauptverfasser: Albers, Sven, Dittes, Marc, Wagner, Thomas, Geissler, Christian, Wolter, Andreas, Seidemann, Georg, Reingruber, Klaus
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method includes aligning a wire with a package body having a contact pad and moving the wire through the package body to form electrical contact with the contact pad.