Method and apparatus for measuring surface properties of polishing pad

A polishing pad surface property measuring method which can measure surface properties of a polishing pad that reflect CMP performance by applying a laser beam to the polishing pad at a plurality of incident angles is disclosed. The method includes applying a laser beam to a surface of the polishing...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Matsuo, Hisanori, Suzuki, Keisuke, Khajornrungruang, Panart, Tajiri, Takahiro, Mochizuki, Yoshihiro
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASURING PERFORMING OPERATIONS PHYSICS POLISHING TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	A polishing pad surface property measuring method which can measure surface properties of a polishing pad that reflect CMP performance by applying a laser beam to the polishing pad at a plurality of incident angles is disclosed. The method includes applying a laser beam to a surface of the polishing pad, and receiving light reflected by the surface of the polishing pad and performing Fourier transform on the received light to determine surface properties of the polishing pad. The laser beam is applied to the polishing pad at a plurality of incident angles.