High strength, high conductivity electroformed copper alloys and methods of making

An electroformed binary copper alloy comprising copper and X, where X is selected from the group consisting of Cr, Fe, W, Mo, B, Co, Ag, and P, having a yield strength of at least 600 MPa and an electrical conductivity of at least 20% IACS is disclosed.

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Bibliographische Detailangaben
Hauptverfasser: Wright, James A, Kwok, Wai Man Raymund, McDonald, Daniel T
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An electroformed binary copper alloy comprising copper and X, where X is selected from the group consisting of Cr, Fe, W, Mo, B, Co, Ag, and P, having a yield strength of at least 600 MPa and an electrical conductivity of at least 20% IACS is disclosed.