Package for an electronic component, electronic component and electronic arrangement

Package for an electronic component, electronic component and electronic arrangement

A package for an electronic component includes a housing and a leadframe embedded in the housing. The leadframe includes a first section, a second section and a third section which are electrically isolated from one another. The first section and the second section each include an L-shape.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Yeoh, Siew Lee, Wong, Wing Yew, Beh, Sok Gek
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package for an electronic component includes a housing and a leadframe embedded in the housing. The leadframe includes a first section, a second section and a third section which are electrically isolated from one another. The first section and the second section each include an L-shape.