Heat management system

The heat management system may include a manifold. The manifold may be configured to couple with the housing. The manifold may include a manifold surface. The manifold surface may be configured to mate with the housing surface. The manifold may include a manifold inlet port. The manifold inlet port...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Kulkarni, Devdatta, Kim, Jae W, Rogers, Blake, Mahajan, Ravindranath V, Chang, Je-young
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CALCULATING COMBINED OPERATIONS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MACHINE TOOLS MECHANICAL ENGINEERING METAL-WORKING NOT OTHERWISE PROVIDED FOR OTHER WORKING OF METAL PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES TRANSPORTING UNIVERSAL MACHINE TOOLS WEAPONS
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Beschreibung
Zusammenfassung:	The heat management system may include a manifold. The manifold may be configured to couple with the housing. The manifold may include a manifold surface. The manifold surface may be configured to mate with the housing surface. The manifold may include a manifold inlet port. The manifold inlet port may be in communication with the manifold surface. The manifold may include a manifold outlet port. The manifold outlet port may be in communication with the manifold surface.