Photosensitive resin and manufacturing method thereof

Various embodiments disclosed relate to photopolymerizable compositions that are suitable for making three-dimensional structures when exposed to laser light.

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Bibliographische Detailangaben
Hauptverfasser:	Qin, Tina, Wiensch, Joshua D
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHIC PROCESSES OR APPARATUS HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PHOTOGRAPHY PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Various embodiments disclosed relate to photopolymerizable compositions that are suitable for making three-dimensional structures when exposed to laser light.