Photocurable resin composition for transferring surface free energy and method for producing substrate using same

The present application provides a photocurable resin composition for transferring surface free energy, the photocurable resin composition including a first compound exhibiting low surface free energy, a second compound exhibiting surface free energy higher than the surface free energy of the first...

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Bibliographische Detailangaben
Hauptverfasser:	Ito, Makiya, Kondo, Hirofumi, Yun, Kyungsung
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CINEMATOGRAPHY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTROGRAPHY FILLING PASTES HOLOGRAPHY INKS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The present application provides a photocurable resin composition for transferring surface free energy, the photocurable resin composition including a first compound exhibiting low surface free energy, a second compound exhibiting surface free energy higher than the surface free energy of the first compound, and a photopolymerization initiator, wherein a difference in transmittance of the photocurable resin composition to a wavelength of 450 nm between before and after addition of the first compound is less than 79.3%, and a method for producing a substrate using the photocurable resin composition.