Shear cutter with improved wear resistance of WC-Co substrate

A cutting element may be formed by sintering together a plurality of metal carbide grains and a metal binder to form a substrate, forming at least one binder gradient in the substrate, and mounting an abrasive layer to the substrate at an interface. The concentration of metal binder material may dec...

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Bibliographische Detailangaben
Hauptverfasser:	Belnap, John Daniel, Voronin, Georgiy, Cariveau, Peter T
Format:	Patent
Sprache:	eng
Schlagworte:	EARTH DRILLING EARTH DRILLING, e.g. DEEP DRILLING FIXED CONSTRUCTIONS GRINDING MINING OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR ASLURRY OF MINERALS FROM WELLS PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	A cutting element may be formed by sintering together a plurality of metal carbide grains and a metal binder to form a substrate, forming at least one binder gradient in the substrate, and mounting an abrasive layer to the substrate at an interface. The concentration of metal binder material may decrease along at least one direction to form the at least one binder gradient.