Rack enclosure with perforations for cooling

The present examples include a rack enclosure with perforations formed within vertical rack columns. Front vertical rack columns may include front perforations formed therein. The front perforations may draw air into the rack enclosure and further into a chassis. Side plenums along the side surface...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Mayer, Dave, Roesner, Arlen L
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present examples include a rack enclosure with perforations formed within vertical rack columns. Front vertical rack columns may include front perforations formed therein. The front perforations may draw air into the rack enclosure and further into a chassis. Side plenums along the side surface of the chassis may consume less space with the use of the front perforations. The space not consumed by the side plenums may be available to accommodate a chassis of a substantial volume. The chassis may expand a substantial width of the rack enclosure to house an enlarged or a maximum number of computing components within the rack enclosure.