Electrically conducting assemblies

The present invention pertains to a process for the manufacture of a multilayer assembly comprising applying at least one patterned substrate onto at least one surface of at least one non-patterned substrate. The present invention also pertains to the multilayer assembly obtainable by said process a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Cojocaru, Paula, Falco, Ivan, Apostolo, Marco, Marrani, Alessio
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MINERAL OR SLAG WOOL ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention pertains to a process for the manufacture of a multilayer assembly comprising applying at least one patterned substrate onto at least one surface of at least one non-patterned substrate. The present invention also pertains to the multilayer assembly obtainable by said process and to uses of said multilayer assembly in various applications.