Moldable adhesive wafers

Disclosed herein are methods and devices for coupling and securing a medical device appliance. In particular, one piece moldable adhesive structures are disclosed which allow customization of an attachment wafer to the size and shape of, for example, a stoma, while allowing flexibility and security...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Johnsen, Kenneth
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Disclosed herein are methods and devices for coupling and securing a medical device appliance. In particular, one piece moldable adhesive structures are disclosed which allow customization of an attachment wafer to the size and shape of, for example, a stoma, while allowing flexibility and security for attaching a medical device, such as an ostomy pouch or other device to the subject.