Wafer cutting apparatus

A wafer cutting apparatus includes a stage to support a wafer, a cutter, and a sensor. The cutter irradiates the wafer with a beam in a first direction to cut the wafer. The sensor is spaced apart from the cutter in a second direction different from the first direction, and measures a spaced distanc...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Kim, In Hwan, Park, Won Ki, Choi, Yeon Woo, Oh, Kyoung Whan, Choi, Yong Won, Lee, Ho Youl
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A wafer cutting apparatus includes a stage to support a wafer, a cutter, and a sensor. The cutter irradiates the wafer with a beam in a first direction to cut the wafer. The sensor is spaced apart from the cutter in a second direction different from the first direction, and measures a spaced distance between the wafer and the cutter. The sensor measures the spaced distance between the wafer and the cutter along a second cutting line parallel to a first cutting line while the cutter cuts the wafer along the first cutting line on the wafer.