Rivetless lead fastening for a semiconductor package

A metal heat slug having an upper and lower surface is provided. First and second electrically conductive leads are provided. First and second electrically insulating fastening mechanisms are provided. The first and second fastening mechanisms are adhered to the upper surface of the heat slug in an...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Ho, Kar Meng, Wong, Jia Yi, Tai, Chiew Li, Murugan, Sanjay Kumar
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A metal heat slug having an upper and lower surface is provided. First and second electrically conductive leads are provided. First and second electrically insulating fastening mechanisms are provided. The first and second fastening mechanisms are adhered to the upper surface of the heat slug in an outer peripheral region of the heat slug such that the first and second leads are vertically separated from and electrically insulated from the heat slug. The central die attach region is exposed from the first and second fastening mechanisms after adhering the first and second fastening mechanisms to the upper surface of the heat slug.