Thermal management of molded packages

An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semicondu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Harirchian, Tannaz, Eid, Feras, Abazarnia, Nader N, Liff, Shawna M, Oster, Sasha N, Beasley, Taesha D, Swan, Johanna M
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!