Thermal management of molded packages

An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semiconductor die, (a)(ii) a second surface opposite the first surface, and (a)(iii) an aperture that extends from the first surface to the second surface; and a polymer substantially filling the aperture; wherein the package molding includes a first thermal conductivity (watts per meter kelvin (W/(m·K)) and the polymer includes a second thermal conductivity that is greater than the first thermal conductivity. Other embodiments are described herein.