Thermal management of molded packages
An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semicondu...
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| creator | Harirchian, Tannaz Eid, Feras Abazarnia, Nader N Liff, Shawna M Oster, Sasha N Beasley, Taesha D Swan, Johanna M |
| description | An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semiconductor die, (a)(ii) a second surface opposite the first surface, and (a)(iii) an aperture that extends from the first surface to the second surface; and a polymer substantially filling the aperture; wherein the package molding includes a first thermal conductivity (watts per meter kelvin (W/(m·K)) and the polymer includes a second thermal conductivity that is greater than the first thermal conductivity. Other embodiments are described herein. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10424559B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10424559B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10424559B23</originalsourceid><addsrcrecordid>eNrjZFANyUgtyk3MUchNzEtMT81NzStRyE9TyM3PSUlNUShITM4GihbzMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjUYqCy1LzUkvjQYEMDEyMTU1NLJyNjYtQAADSDJy8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thermal management of molded packages</title><source>esp@cenet</source><creator>Harirchian, Tannaz ; Eid, Feras ; Abazarnia, Nader N ; Liff, Shawna M ; Oster, Sasha N ; Beasley, Taesha D ; Swan, Johanna M</creator><creatorcontrib>Harirchian, Tannaz ; Eid, Feras ; Abazarnia, Nader N ; Liff, Shawna M ; Oster, Sasha N ; Beasley, Taesha D ; Swan, Johanna M</creatorcontrib><description>An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semiconductor die, (a)(ii) a second surface opposite the first surface, and (a)(iii) an aperture that extends from the first surface to the second surface; and a polymer substantially filling the aperture; wherein the package molding includes a first thermal conductivity (watts per meter kelvin (W/(m·K)) and the polymer includes a second thermal conductivity that is greater than the first thermal conductivity. Other embodiments are described herein.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190924&DB=EPODOC&CC=US&NR=10424559B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190924&DB=EPODOC&CC=US&NR=10424559B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Harirchian, Tannaz</creatorcontrib><creatorcontrib>Eid, Feras</creatorcontrib><creatorcontrib>Abazarnia, Nader N</creatorcontrib><creatorcontrib>Liff, Shawna M</creatorcontrib><creatorcontrib>Oster, Sasha N</creatorcontrib><creatorcontrib>Beasley, Taesha D</creatorcontrib><creatorcontrib>Swan, Johanna M</creatorcontrib><title>Thermal management of molded packages</title><description>An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semiconductor die, (a)(ii) a second surface opposite the first surface, and (a)(iii) an aperture that extends from the first surface to the second surface; and a polymer substantially filling the aperture; wherein the package molding includes a first thermal conductivity (watts per meter kelvin (W/(m·K)) and the polymer includes a second thermal conductivity that is greater than the first thermal conductivity. Other embodiments are described herein.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFANyUgtyk3MUchNzEtMT81NzStRyE9TyM3PSUlNUShITM4GihbzMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjUYqCy1LzUkvjQYEMDEyMTU1NLJyNjYtQAADSDJy8</recordid><startdate>20190924</startdate><enddate>20190924</enddate><creator>Harirchian, Tannaz</creator><creator>Eid, Feras</creator><creator>Abazarnia, Nader N</creator><creator>Liff, Shawna M</creator><creator>Oster, Sasha N</creator><creator>Beasley, Taesha D</creator><creator>Swan, Johanna M</creator><scope>EVB</scope></search><sort><creationdate>20190924</creationdate><title>Thermal management of molded packages</title><author>Harirchian, Tannaz ; Eid, Feras ; Abazarnia, Nader N ; Liff, Shawna M ; Oster, Sasha N ; Beasley, Taesha D ; Swan, Johanna M</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10424559B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Harirchian, Tannaz</creatorcontrib><creatorcontrib>Eid, Feras</creatorcontrib><creatorcontrib>Abazarnia, Nader N</creatorcontrib><creatorcontrib>Liff, Shawna M</creatorcontrib><creatorcontrib>Oster, Sasha N</creatorcontrib><creatorcontrib>Beasley, Taesha D</creatorcontrib><creatorcontrib>Swan, Johanna M</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Harirchian, Tannaz</au><au>Eid, Feras</au><au>Abazarnia, Nader N</au><au>Liff, Shawna M</au><au>Oster, Sasha N</au><au>Beasley, Taesha D</au><au>Swan, Johanna M</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermal management of molded packages</title><date>2019-09-24</date><risdate>2019</risdate><abstract>An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semiconductor die, (a)(ii) a second surface opposite the first surface, and (a)(iii) an aperture that extends from the first surface to the second surface; and a polymer substantially filling the aperture; wherein the package molding includes a first thermal conductivity (watts per meter kelvin (W/(m·K)) and the polymer includes a second thermal conductivity that is greater than the first thermal conductivity. Other embodiments are described herein.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Thermal management of molded packages |
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