Methods and apparatuses for electroplating and seed layer detection

Disclosed herein are methods for electroplating which employ seed layer detection. Such methods may operate by selecting a wafer, illuminating one or more points within an interior region of the wafer surface, measuring a first set of one or more in-process color signals from the one or more points...

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Bibliographische Detailangaben
Hauptverfasser:	Dinneen, Daniel Mark, Mayer, Steven T
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING METALLURGY PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	Disclosed herein are methods for electroplating which employ seed layer detection. Such methods may operate by selecting a wafer, illuminating one or more points within an interior region of the wafer surface, measuring a first set of one or more in-process color signals from the one or more points within the interior region, illuminating one or more points within an edge region of the wafer surface, measuring a second set of one or more in-process color signals from the one or more points within the edge region, each color signal having one or more color components, calculating a metric indicative of a difference between the color signals in the first and second sets of in-process color signals, determining whether an acceptable seed layer is present on the wafer based on whether the metric is within a predetermined range, and repeating the foregoing for one or more additional wafers.