MEMS transducer package

A MEMS transducer package is provided having a semiconductor die portion with a thickness bounded by a first surface and an opposite second surface. The package further has a transducer element incorporated in the second surface and a die back volume that extends through the thickness of the semicon...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Hoekstra, Tsjerk
Format:	Patent
Sprache:	eng
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS
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