MEMS transducer package

MEMS transducer package

A MEMS transducer package is provided having a semiconductor die portion with a thickness bounded by a first surface and an opposite second surface. The package further has a transducer element incorporated in the second surface and a die back volume that extends through the thickness of the semicon...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Hoekstra, Tsjerk
Format: Patent
Sprache:eng
Schlagworte:
DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
PUBLIC ADDRESS SYSTEMS
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Beschreibung
Zusammenfassung:A MEMS transducer package is provided having a semiconductor die portion with a thickness bounded by a first surface and an opposite second surface. The package further has a transducer element incorporated in the second surface and a die back volume that extends through the thickness of the semiconductor die portion between the first surface and the transducer element. The package is completed by a cap portion that abuts the semiconductor die portion at the first surface.