Conductive polypropylene-based foamed resin particles, method for production thereof, and polypropylene-based foamed molding article

Conductive polypropylene-based foamed resin particles foamed particles includes a resin composition containing 100 parts by weight of a polypropylene-based resin, 17.6 parts by weight to 33.4 parts by weight of conductive carbon black, and 0.1 parts by weight to 3.0 parts by weight of a water-solubl...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	Sato, Keishi
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Conductive polypropylene-based foamed resin particles foamed particles includes a resin composition containing 100 parts by weight of a polypropylene-based resin, 17.6 parts by weight to 33.4 parts by weight of conductive carbon black, and 0.1 parts by weight to 3.0 parts by weight of a water-soluble organic substance. The resin composition has a melting point (Tm) of 145° C. to 155° C., as measured by a differential scanning calorimetry (DSC) method, and has a temperature difference (ΔT) of 50° C. or more between the melting point (Tm) and a crystal melting start temperature (Tl) in a DSC differential scanning calorimetry (DSC) curve.