Method of manufacturing a semiconductor device and interconnection structures thereof
A semiconductor device and a manufacturing method thereof, which can reduce a size of the semiconductor device. As a non-limiting example, various aspects of this disclosure provide for a reduction in package size based at least in part on patterning techniques for forming interconnection structures...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A semiconductor device and a manufacturing method thereof, which can reduce a size of the semiconductor device. As a non-limiting example, various aspects of this disclosure provide for a reduction in package size based at least in part on patterning techniques for forming interconnection structures. |
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