Molding with integrated electrode pattern and method for manufacturing same

A molding with an integrated electrode pattern, including a resin molded body having a first surface and a second surface opposing each other; a first film that is formed on the first surface and that includes an electrode pattern and a first lead-out wire electrically connected to the electrode pat...

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Bibliographische Detailangaben
Hauptverfasser:	Yamazaki, Seiichi, Takinishi, Yasuisa, Iga, Toshihiro
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A molding with an integrated electrode pattern, including a resin molded body having a first surface and a second surface opposing each other; a first film that is formed on the first surface and that includes an electrode pattern and a first lead-out wire electrically connected to the electrode pattern, the first film not being covered by the resin molded body; and a second film that stands on the first surface, and that includes a second lead-out wire electrically connected to the first lead-out wire, the second film having a rectangular shape, and the resin molded body includes a pair of support wall portions formed integrally with the first surface so as to stand on the first surface and clamp both ends of a base part of the second film.