Placement of vias in printed circuit board circuits

In some examples, an electronic device includes a printed circuit board (PCB) device that includes a first trace electrically connected to a first pad of a first trace via on a first layer and a second trace electrically connected to a second pad of a second trace via on a second layer. In some exam...

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Bibliographische Detailangaben
Hauptverfasser: Chang, Edward C, Doppalapudi, Ranjeeth, Chengson, David P, Pappu, Santosh Kumar
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:In some examples, an electronic device includes a printed circuit board (PCB) device that includes a first trace electrically connected to a first pad of a first trace via on a first layer and a second trace electrically connected to a second pad of a second trace via on a second layer. In some examples, the PCB device also includes four ground pads on the first layer and an antipad surrounding the two trace vias, where a first ground pad is positioned between the first trace and the second trace, where the first ground pad and the second ground pad are approximately symmetrically positioned about a perpendicular bisector of a line from the first pad to the second pad, and wherein the third ground pad and the fourth ground pad are approximately symmetrically positioned about the perpendicular bisector of the line from the first pad to the second pad.