Semiconductor device including one or more semiconductor chips on a substrate
In one embodiment, a semiconductor device includes a substrate, and a first wiring layer provided on the substrate. The device further includes a first insulator provided on the substrate and the first wiring layer and including an opening. The device further includes a first semiconductor chip prov...
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| Sprache: | eng |
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| Zusammenfassung: | In one embodiment, a semiconductor device includes a substrate, and a first wiring layer provided on the substrate. The device further includes a first insulator provided on the substrate and the first wiring layer and including an opening. The device further includes a first semiconductor chip provided above the substrate and in the opening of the first insulator, and a wire electrically connecting the first semiconductor chip and the first wiring layer. |
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