Semiconductor devices with improved thermal and electrical performance

Semiconductor devices with improved thermal and electrical performance

A device may include a carrier, a semiconductor chip arranged over a first surface of the carrier, and an encapsulation body comprising six side surfaces and encapsulating the semiconductor chip. A second surface of the carrier opposite to the first surface of the carrier is exposed from the encapsu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Schnoy, Fabian, Kirchner, Uwe, Schmoelzer, Bernd, Stueckler, Franz, Lohmann, Guenther, Hud, Amirul Afiq, Grawert, Felix, Fuergut, Edward, Low, Hwee Yin, Otremba, Ralf, Lee, Teck Sim
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A device may include a carrier, a semiconductor chip arranged over a first surface of the carrier, and an encapsulation body comprising six side surfaces and encapsulating the semiconductor chip. A second surface of the carrier opposite to the first surface of the carrier is exposed from the encapsulation body. The device may further include electrical contact elements electrically coupled to the semiconductor chip and protruding out of the encapsulation body exclusively through two opposing side surfaces of the encapsulation body which have the smallest surface areas of all the side surfaces of the encapsulation body, and an electrically insulating layer arranged over the exposed second surface of the carrier.