Defect analysis
A system for analyzing defects comprises determining coordinates of a defect using a wafer inspection tool; identifying a structure of interest near the defect coordinates; directing a focused ion beam toward the wafer to expose the structure of interest; and forming an image of the exposed structur...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A system for analyzing defects comprises determining coordinates of a defect using a wafer inspection tool; identifying a structure of interest near the defect coordinates; directing a focused ion beam toward the wafer to expose the structure of interest; and forming an image of the exposed structure of interest, wherein the focused ion beam is directed to the mill at a location corresponding to the identified structure of interest rather than at the coordinates of the defect. |
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