Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool

Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool

Systems and methods for processing phase maps acquired using interferometer wafer geometry tools are disclosed. More specifically, instead of performing phase unwrapping first and then analyze the unwrapped data in a height domain, systems and methods in accordance with the present disclosure operat...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Tang, Shouhong, Sinha, Jaydeep, Kamensky, Sergey, Chen, Haiguang
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
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Beschreibung
Zusammenfassung:Systems and methods for processing phase maps acquired using interferometer wafer geometry tools are disclosed. More specifically, instead of performing phase unwrapping first and then analyze the unwrapped data in a height domain, systems and methods in accordance with the present disclosure operate in a curvature domain without having to perform any phase unwrapping.