Multi-chip package of power semiconductor

A multi-chip package of power semiconductor includes a lead frame, a first segment group, a second segment group, a first power semiconductor chip and a second power semiconductor chip. The lead frame includes a first segment group having a first gate segment, a first source segment, and a first dra...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Go, Si Hyeon, Oh, Dong Seong, Park, Myung Ho, Kim, Beom Su, Choi, Jae Sik
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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