High-frequency module

A high-frequency module includes a wiring board; a plurality of components mounted on an upper surface of the wiring board; a sealing resin layer that is stacked on the upper surface of the wiring board and that has a step; a groove that is formed in the sealing resin layer to intersect with the ste...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Masuda, Yoshihisa, Otsubo, Yoshihito
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A high-frequency module includes a wiring board; a plurality of components mounted on an upper surface of the wiring board; a sealing resin layer that is stacked on the upper surface of the wiring board and that has a step; a groove that is formed in the sealing resin layer to intersect with the step when the wiring board is viewed in plan view, and that extends between predetermined components; and a shield wall disposed in the groove and formed with a conductor. The groove includes a first portion at an upper surface side of the wiring board and a second portion at an upper surface side of the sealing resin layer, the second portion being continuous from the first portion. An area of the second portion is larger than an area of the second portion.