Area-efficient connections to SIP modules

Connectors that allow system-in-package modules to connect to other circuits in an electronic device in an area-efficient manner.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Hoang, Lan H, Katahira, Takayoshi
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Connectors that allow system-in-package modules to connect to other circuits in an electronic device in an area-efficient manner.