Bonded system and a method for adhesively bonding a hygroscopic material

Bonded system and a method for adhesively bonding a hygroscopic material

A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Schmidt, Tobias, Altschaeffl, Christian, Porwol, Daniel, Schweiger, Christian, Muehlbauer, Franz Xaver, Von Waechter, Claus, Doepke, Holger, Von Koblinski, Carsten, Hoeckele, Uwe
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.