Layout structure of flexible circuit board

A layout structure of flexible circuit board includes a flexible substrate and leads formed on a surface of the flexible substrate. Each of the leads has a bump connection end and a curved part. The bump connection end of each of the leads is located on a chip disposition area of the surface and ele...

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Bibliographische Detailangaben
1. Verfasser: Hsieh, Chin-Tang
Format: Patent
Sprache:eng
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Zusammenfassung:A layout structure of flexible circuit board includes a flexible substrate and leads formed on a surface of the flexible substrate. Each of the leads has a bump connection end and a curved part. The bump connection end of each of the leads is located on a chip disposition area of the surface and electrically connected to a chip. The curved part has a first connection point and a second connection point, and the length of the curved part is longer than a straight-line distance between the first and second connection points.