Organic layer composition and method of forming patterns

A method of measuring the thermal shrinkage ratio is described in the detailed description.

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Hauptverfasser: Kim, Minsoo, Song, Hyunji, Hong, Seunghee, Baek, Jaeyeol, Jeong, Seulgi, Hwang, Sunmin, Yoon, Byeri, Nam, Younhee
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container_issue
container_start_page
container_title
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creator Kim, Minsoo
Song, Hyunji
Hong, Seunghee
Baek, Jaeyeol
Jeong, Seulgi
Hwang, Sunmin
Yoon, Byeri
Nam, Younhee
description A method of measuring the thermal shrinkage ratio is described in the detailed description.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10323159B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10323159B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10323159B23</originalsourceid><addsrcrecordid>eNrjZLDwL0pPzMtMVshJrEwtUkjOzy3IL84syczPU0jMS1HITS3JyE9RyE9TSMsvys3MS1coSCwpSS3KK-ZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYYGxkbGhqaWTkbGxKgBACMJLqM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Organic layer composition and method of forming patterns</title><source>esp@cenet</source><creator>Kim, Minsoo ; Song, Hyunji ; Hong, Seunghee ; Baek, Jaeyeol ; Jeong, Seulgi ; Hwang, Sunmin ; Yoon, Byeri ; Nam, Younhee</creator><creatorcontrib>Kim, Minsoo ; Song, Hyunji ; Hong, Seunghee ; Baek, Jaeyeol ; Jeong, Seulgi ; Hwang, Sunmin ; Yoon, Byeri ; Nam, Younhee</creatorcontrib><description>A method of measuring the thermal shrinkage ratio is described in the detailed description.</description><language>eng</language><subject>ADHESIVES ; APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; CINEMATOGRAPHY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CORRECTING FLUIDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; FILLING PASTES ; HOLOGRAPHY ; INKS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MATERIALS THEREFOR ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190618&amp;DB=EPODOC&amp;CC=US&amp;NR=10323159B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190618&amp;DB=EPODOC&amp;CC=US&amp;NR=10323159B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kim, Minsoo</creatorcontrib><creatorcontrib>Song, Hyunji</creatorcontrib><creatorcontrib>Hong, Seunghee</creatorcontrib><creatorcontrib>Baek, Jaeyeol</creatorcontrib><creatorcontrib>Jeong, Seulgi</creatorcontrib><creatorcontrib>Hwang, Sunmin</creatorcontrib><creatorcontrib>Yoon, Byeri</creatorcontrib><creatorcontrib>Nam, Younhee</creatorcontrib><title>Organic layer composition and method of forming patterns</title><description>A method of measuring the thermal shrinkage ratio is described in the detailed description.</description><subject>ADHESIVES</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>FILLING PASTES</subject><subject>HOLOGRAPHY</subject><subject>INKS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDwL0pPzMtMVshJrEwtUkjOzy3IL84syczPU0jMS1HITS3JyE9RyE9TSMsvys3MS1coSCwpSS3KK-ZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYYGxkbGhqaWTkbGxKgBACMJLqM</recordid><startdate>20190618</startdate><enddate>20190618</enddate><creator>Kim, Minsoo</creator><creator>Song, Hyunji</creator><creator>Hong, Seunghee</creator><creator>Baek, Jaeyeol</creator><creator>Jeong, Seulgi</creator><creator>Hwang, Sunmin</creator><creator>Yoon, Byeri</creator><creator>Nam, Younhee</creator><scope>EVB</scope></search><sort><creationdate>20190618</creationdate><title>Organic layer composition and method of forming patterns</title><author>Kim, Minsoo ; Song, Hyunji ; Hong, Seunghee ; Baek, Jaeyeol ; Jeong, Seulgi ; Hwang, Sunmin ; Yoon, Byeri ; Nam, Younhee</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10323159B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>ADHESIVES</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>FILLING PASTES</topic><topic>HOLOGRAPHY</topic><topic>INKS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>Kim, Minsoo</creatorcontrib><creatorcontrib>Song, Hyunji</creatorcontrib><creatorcontrib>Hong, Seunghee</creatorcontrib><creatorcontrib>Baek, Jaeyeol</creatorcontrib><creatorcontrib>Jeong, Seulgi</creatorcontrib><creatorcontrib>Hwang, Sunmin</creatorcontrib><creatorcontrib>Yoon, Byeri</creatorcontrib><creatorcontrib>Nam, Younhee</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kim, Minsoo</au><au>Song, Hyunji</au><au>Hong, Seunghee</au><au>Baek, Jaeyeol</au><au>Jeong, Seulgi</au><au>Hwang, Sunmin</au><au>Yoon, Byeri</au><au>Nam, Younhee</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Organic layer composition and method of forming patterns</title><date>2019-06-18</date><risdate>2019</risdate><abstract>A method of measuring the thermal shrinkage ratio is described in the detailed description.</abstract><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects ADHESIVES
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
CINEMATOGRAPHY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COMPOSITIONS BASED THEREON
CORRECTING FLUIDS
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
FILLING PASTES
HOLOGRAPHY
INKS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MATERIALS THEREFOR
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
POLISHES
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS THEREFOR
WOODSTAINS
title Organic layer composition and method of forming patterns
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T20%3A49%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kim,%20Minsoo&rft.date=2019-06-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10323159B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true