Organic layer composition and method of forming patterns
A method of measuring the thermal shrinkage ratio is described in the detailed description.
Gespeichert in:
Hauptverfasser: | , , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Kim, Minsoo Song, Hyunji Hong, Seunghee Baek, Jaeyeol Jeong, Seulgi Hwang, Sunmin Yoon, Byeri Nam, Younhee |
description | A method of measuring the thermal shrinkage ratio is described in the detailed description. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10323159B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10323159B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10323159B23</originalsourceid><addsrcrecordid>eNrjZLDwL0pPzMtMVshJrEwtUkjOzy3IL84syczPU0jMS1HITS3JyE9RyE9TSMsvys3MS1coSCwpSS3KK-ZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYYGxkbGhqaWTkbGxKgBACMJLqM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Organic layer composition and method of forming patterns</title><source>esp@cenet</source><creator>Kim, Minsoo ; Song, Hyunji ; Hong, Seunghee ; Baek, Jaeyeol ; Jeong, Seulgi ; Hwang, Sunmin ; Yoon, Byeri ; Nam, Younhee</creator><creatorcontrib>Kim, Minsoo ; Song, Hyunji ; Hong, Seunghee ; Baek, Jaeyeol ; Jeong, Seulgi ; Hwang, Sunmin ; Yoon, Byeri ; Nam, Younhee</creatorcontrib><description>A method of measuring the thermal shrinkage ratio is described in the detailed description.</description><language>eng</language><subject>ADHESIVES ; APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; CINEMATOGRAPHY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CORRECTING FLUIDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; FILLING PASTES ; HOLOGRAPHY ; INKS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MATERIALS THEREFOR ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190618&DB=EPODOC&CC=US&NR=10323159B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190618&DB=EPODOC&CC=US&NR=10323159B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kim, Minsoo</creatorcontrib><creatorcontrib>Song, Hyunji</creatorcontrib><creatorcontrib>Hong, Seunghee</creatorcontrib><creatorcontrib>Baek, Jaeyeol</creatorcontrib><creatorcontrib>Jeong, Seulgi</creatorcontrib><creatorcontrib>Hwang, Sunmin</creatorcontrib><creatorcontrib>Yoon, Byeri</creatorcontrib><creatorcontrib>Nam, Younhee</creatorcontrib><title>Organic layer composition and method of forming patterns</title><description>A method of measuring the thermal shrinkage ratio is described in the detailed description.</description><subject>ADHESIVES</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>FILLING PASTES</subject><subject>HOLOGRAPHY</subject><subject>INKS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDwL0pPzMtMVshJrEwtUkjOzy3IL84syczPU0jMS1HITS3JyE9RyE9TSMsvys3MS1coSCwpSS3KK-ZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYYGxkbGhqaWTkbGxKgBACMJLqM</recordid><startdate>20190618</startdate><enddate>20190618</enddate><creator>Kim, Minsoo</creator><creator>Song, Hyunji</creator><creator>Hong, Seunghee</creator><creator>Baek, Jaeyeol</creator><creator>Jeong, Seulgi</creator><creator>Hwang, Sunmin</creator><creator>Yoon, Byeri</creator><creator>Nam, Younhee</creator><scope>EVB</scope></search><sort><creationdate>20190618</creationdate><title>Organic layer composition and method of forming patterns</title><author>Kim, Minsoo ; Song, Hyunji ; Hong, Seunghee ; Baek, Jaeyeol ; Jeong, Seulgi ; Hwang, Sunmin ; Yoon, Byeri ; Nam, Younhee</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10323159B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>ADHESIVES</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>FILLING PASTES</topic><topic>HOLOGRAPHY</topic><topic>INKS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>Kim, Minsoo</creatorcontrib><creatorcontrib>Song, Hyunji</creatorcontrib><creatorcontrib>Hong, Seunghee</creatorcontrib><creatorcontrib>Baek, Jaeyeol</creatorcontrib><creatorcontrib>Jeong, Seulgi</creatorcontrib><creatorcontrib>Hwang, Sunmin</creatorcontrib><creatorcontrib>Yoon, Byeri</creatorcontrib><creatorcontrib>Nam, Younhee</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kim, Minsoo</au><au>Song, Hyunji</au><au>Hong, Seunghee</au><au>Baek, Jaeyeol</au><au>Jeong, Seulgi</au><au>Hwang, Sunmin</au><au>Yoon, Byeri</au><au>Nam, Younhee</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Organic layer composition and method of forming patterns</title><date>2019-06-18</date><risdate>2019</risdate><abstract>A method of measuring the thermal shrinkage ratio is described in the detailed description.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US10323159B2 |
source | esp@cenet |
subjects | ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CINEMATOGRAPHY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FILLING PASTES HOLOGRAPHY INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS |
title | Organic layer composition and method of forming patterns |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T20%3A49%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kim,%20Minsoo&rft.date=2019-06-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10323159B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |