Printed circuit board with dam around cavity and manufacturing method thereof

Printed circuit board with dam around cavity and manufacturing method thereof

A printed circuit board includes a first substrate including a first insulation layer and a first circuit layer including a bonding pad, the bonding pad disposed on the first insulation layer, a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outsi...

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Hauptverfasser: Jung, Soon-Oh, Baek, Yong-Ho, Ko, Kyung-Hwan, Mok, Jee-Soo, Ko, Young-Gwan, Lee, Jae-Ean
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator Jung, Soon-Oh
Baek, Yong-Ho
Ko, Kyung-Hwan
Mok, Jee-Soo
Ko, Young-Gwan
Lee, Jae-Ean
description A printed circuit board includes a first substrate including a first insulation layer and a first circuit layer including a bonding pad, the bonding pad disposed on the first insulation layer, a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outside, and a dam disposed between the bonding pad and an inner wall of the cavity.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Printed circuit board with dam around cavity and manufacturing method thereof
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