Printed circuit board with dam around cavity and manufacturing method thereof

Printed circuit board with dam around cavity and manufacturing method thereof

A printed circuit board includes a first substrate including a first insulation layer and a first circuit layer including a bonding pad, the bonding pad disposed on the first insulation layer, a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outsi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Jung, Soon-Oh, Baek, Yong-Ho, Ko, Kyung-Hwan, Mok, Jee-Soo, Ko, Young-Gwan, Lee, Jae-Ean
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A printed circuit board includes a first substrate including a first insulation layer and a first circuit layer including a bonding pad, the bonding pad disposed on the first insulation layer, a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outside, and a dam disposed between the bonding pad and an inner wall of the cavity.