Laser ablative dielectric material

Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Th...

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Bibliographische Detailangaben
Hauptverfasser:	Blumenshine, Deborah, Southard, Arthur O, Matos-Perez, Christina R, Flaim, Tony D, Kirchner, Lisa M
Format:	Patent
Sprache:	eng
Schlagworte:	ACYCLIC OR CARBOCYCLIC COMPOUNDS BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTING PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTINGSURFACES SEMICONDUCTOR DEVICES STAMPS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.