Semiconductor device
A semiconductor device is provided, including: a bottom portion having a pad formed of a conductive material; a lid portion covering at least a part of the bottom portion; and a first terminal portion and a second terminal portion which are provided in parallel with each other, are fixed to the lid...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A semiconductor device is provided, including: a bottom portion having a pad formed of a conductive material; a lid portion covering at least a part of the bottom portion; and a first terminal portion and a second terminal portion which are provided in parallel with each other, are fixed to the lid portion, and each contact a corresponding pad, wherein: the first terminal portion is provided with a first plate-shaped portion; the second terminal portion is provided with a second plate-shaped portion; and each of the first plate-shaped portion and the second plate-shaped portion has a principal surface in a direction facing the pad and is flexible in a direction toward the pad. |
|---|