Stable electroless copper plating compositions and methods for electroless plating copper on substrates

A specific cysteine derivative is added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating tem...

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Bibliographische Detailangaben
Hauptverfasser:	Lifschitz Arribio, Alejo M, Cleary, Donald E
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A specific cysteine derivative is added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.