Weld joint with constant overlap area

A packaged semiconductor device has a plurality of leads. A respective lead is to be welded to an electrical coupling that has a substantially rectangular end section. The end section has a width that is greater than a width of the respective lead. The respective lead is aligned within the width of...

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Bibliographische Detailangaben
Hauptverfasser:	Liu, Wenjun, Ramm, Robert James
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS,e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USERAPPLICATIONS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERATION SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	A packaged semiconductor device has a plurality of leads. A respective lead is to be welded to an electrical coupling that has a substantially rectangular end section. The end section has a width that is greater than a width of the respective lead. The respective lead is aligned within the width of the end section, such that the respective lead extends in a direction substantially perpendicular to the width of the end section. With the respective lead and the end section aligned, the respective lead is welded to the end section.