Fragmenting computer chips

A method comprising bonding a first substrate to a second substrate. The first substrate includes a layer of one or more pairs of reactive material. The method comprising triggering a reaction between the one or more pairs of reactive material and fragmenting the second substrate.

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Bibliographische Detailangaben
Hauptverfasser:	Cabral, Jr., Cyril, Rodbell, Kenneth P
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY EXPLOSIVES EXPLOSIVES OR THERMIC COMPOSITIONS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE THEREOF MATCHES METALLURGY PRINTED CIRCUITS SEMICONDUCTOR DEVICES USE OF SINGLE SUBSTANCES AS EXPLOSIVES
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Beschreibung
Zusammenfassung:	A method comprising bonding a first substrate to a second substrate. The first substrate includes a layer of one or more pairs of reactive material. The method comprising triggering a reaction between the one or more pairs of reactive material and fragmenting the second substrate.