Multilayer substrate and manufacturing method for the multilayer substrate

A multilayer substrate is manufactured by first manufacturing a first substrate by stacking and hot-pressing resin base materials of the first substrate and then adjacently stacking and hot-pressing the first substrate and resin base materials that constitute a second substrate at a position overlap...

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Bibliographische Detailangaben
1. Verfasser:	Yosui, Kuniaki
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	A multilayer substrate is manufactured by first manufacturing a first substrate by stacking and hot-pressing resin base materials of the first substrate and then adjacently stacking and hot-pressing the first substrate and resin base materials that constitute a second substrate at a position overlapping with each other in a stacking direction. The position in the stacking direction between the resin base materials in the first substrate is located at almost a middle position in the stacking direction of a resin base material of the second substrate, and is different from the position between the layers of the resin base materials of the second substrate.