Semiconductor device for detecting a poor contact of a power pad

A semiconductor device may include a first pad configured to provide a first voltage. The semiconductor device may include a second pad. The semiconductor device may include a connection circuit configured to couple the first pad to the second pad on the basis of a connection signal or electrically...

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Bibliographische Detailangaben
1. Verfasser:	Park, Nak Kyu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PULSE TECHNIQUE SEMICONDUCTOR DEVICES STATIC STORES TESTING
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Beschreibung
Zusammenfassung:	A semiconductor device may include a first pad configured to provide a first voltage. The semiconductor device may include a second pad. The semiconductor device may include a connection circuit configured to couple the first pad to the second pad on the basis of a connection signal or electrically separate the second pad from the first pad on the basis of the connection signal. The semiconductor device may include a detection circuit configured to generate a defect detection signal on the basis of a test mode signal and a second voltage received from the second pad.