Manufacturing method of package structure having conductive shield

A manufacturing method of a package structure including the following steps is provided. A plurality of first conductive connectors and a second conductive connector on an active surface of a die are formed. The first conductive connectors are electrically connected to the die. The second conductive...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Fang, Li-Chih, Lin, Chun-Te, Chu, Che-Min, Lin, Ji-Cheng, Chiang, Chia-Wei
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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