Manufacturing method of package structure having conductive shield

A manufacturing method of a package structure including the following steps is provided. A plurality of first conductive connectors and a second conductive connector on an active surface of a die are formed. The first conductive connectors are electrically connected to the die. The second conductive...

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Bibliographische Detailangaben
Hauptverfasser:	Fang, Li-Chih, Lin, Chun-Te, Chu, Che-Min, Lin, Ji-Cheng, Chiang, Chia-Wei
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A manufacturing method of a package structure including the following steps is provided. A plurality of first conductive connectors and a second conductive connector on an active surface of a die are formed. The first conductive connectors are electrically connected to the die. The second conductive connector is formed aside the first conductive connectors and electrically insulated to the die. A redistribution layer is formed on the die. The redistribution layer is electrically connected to the first conductive connectors and the second conductive connector. A conductive shield is formed on the redistribution layer to surround the second conductive connector and at least a portion of a sidewall of the die coupled the active surface. The die is electrically insulated from the conductive shield. Another manufacturing method of a package structure is also provided.