Support substrates for microfluidic die

The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigi...

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Bibliographische Detailangaben
Hauptverfasser: Dodd, Simon, Gruenbacher, Dana, Hunt, David S, Scheffelin, Joseph Edward, Janouch, Peter, Hollinger, Stefan H, Schober, Uwe
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.