Device for absorbing heat

A device for absorbing heat generated by curing of a curable matrix material, particularly heat generated by curing of a curable matrix material embedding a textile structure including a number of reinforcing fibers is provided. The device includes at least one envelope element defining at least one...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Olesen, Bendt, Jensen, Martin
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A device for absorbing heat generated by curing of a curable matrix material, particularly heat generated by curing of a curable matrix material embedding a textile structure including a number of reinforcing fibers is provided. The device includes at least one envelope element defining at least one inner volume, and at least one thermally conductive heat absorbing element disposed within the at least one inner volume of the at least one envelope element. In a further embodiment, the at least one envelope element may be built of or include at least one non-adhering material which does not adhere to the curable or cured matrix material.